Hong Kong MECHANIC XG-Z40 BGA Soldering Paste Sn63/Pb37 for Cell Phone Repair
- The quality of solder paste, excellent wetting, high reliability.
- Effectively prevent the collapse of the printing and preheat.
- Tack lasting, easy to dry, sticky time for more than 48 hours.
- A colorless transparent, does not affect the test, fine-clean and cleaning performance.
- Products wetting, anti-dry and strong, long shelf life at room temperature.
- Adapted to the mobile phone repair industry.
- computer digital service industries
- High-precision circuit board soldering SMT, BGA soldering processes, etc.
- Type: XG-z40
- Alloy: Sn63/Pb37
- Microns: 25-45um
- Volume: 10cc
What’s In The Box:
- 1 X solder paste